SMT process of surface mount technology

Single-sided assembly
Incoming material inspection => Silk screen solder paste (sMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Inspection => Rework
Double-sided assembly
A: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD PCB Silk screen solder paste (sMD glue) on PCB B side => SMD => Drying => Reflow soldering (preferably only on B side => Cleaning => Inspection => Rework).
B: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD => Drying (curing) => Reflow soldering on A side => Cleaning => Flip board => SMD glue on PCB B side => SMD => Curing => Wave soldering on B side => Cleaning => Inspection => Rework)
This process is suitable for reflow soldering on PCB A side and wave soldering on B side. This process is suitable for SMDs assembled on the B side of the PCB when there are only SOT or SOIC (28) pins or less.
Single-sided mixed assembly process
Incoming material inspection => Screen printing solder paste on the A side of the PCB (applying SMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Plug-in => Wave soldering => Cleaning => Inspection => Rework
Double-sided mixed assembly process
A: Incoming material inspection => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Plug-in on the A side of the PCB => Wave soldering => Cleaning => Inspection => Rework
Apply first and then insert, which is suitable for the situation where there are more SMD components than discrete components.
B: Incoming material inspection => Plug-in on the A side of the PCB (pin bending) => Flip board => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection => Rework
Insert first and then apply, which is suitable for the situation where there are more discrete components than SMD components.
C: Incoming material inspection => PCB A side screen printing solder paste => SMD => Drying => Reflow soldering => Plug-in, pin bending => Flip board => PCB B side SMD glue => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD.
D: Incoming material inspection => PCB B side SMD glue => SMD => Curing => Flip board => PCB A side screen printing solder paste => SMD => Reflow soldering => Plug-in => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD. First paste SMD on both sides, reflow soldering, then plug-in, wave soldering E: Incoming material inspection => Silk screen solder paste (smear patch glue) on the B side of the PCB => Smear => Drying (curing) => Reflow soldering => Flip board => Silk screen solder paste on the A side of the PCB => Smear => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Inspection => Rework A side mounting, B side mixed mounting.
Double-sided assembly process
A: Incoming material inspection, silk screen solder paste (smear patch glue) on the A side of the PCB, Smear, drying (curing), A side reflow soldering, cleaning, flip board; silk screen solder paste (smear patch glue) on the B side of the PCB, Smear, drying, reflow soldering (preferably only for the B side, cleaning, inspection, rework)
This process is suitable for mounting large SMDs such as PLCC on both sides of the PCB.
B: Incoming material inspection, screen printing solder paste on side A of PCB (applying SMD glue), SMD, drying (curing), reflow soldering on side A, cleaning, and flipping; applying SMD glue on side B of PCB, SMD, curing, wave soldering on side B, cleaning, inspection, and rework) This process is suitable for reflow on side A of PCB.