Structural composition Rigid-flex PCB mainly consists of two parts: rigid part and flexible part. Its structure usually includes the following levels:
· Rigid layer: Made of traditional PCB materials, it provides stable electrical performance and mechanical strength. FR-4 or other high-performance substrates are usually used.
· Flexible layer: Made of flexible circuit materials (such as polyimide or polyester), it provides high bending ability and folding resistance.
· Connection area: The connection part between the rigid layer and the flexible layer, which is usually achieved using a special adhesive or welding process.
Design points
· Stacking structure: Reasonable stacking sequence and thickness design are the key to ensuring the performance of rigid-flex PCB. Generally, the thickness ratio of the rigid layer and the flexible layer needs to be considered in the design to meet the needs of different applications.
· Pad and connector design: Ensure that the design of the pad meets the size requirements of the component, and the connector should be designed in a suitable position for easy assembly and maintenance.
· Signal integrity: Signal integrity needs to be considered during the design process to avoid interference with signal transmission caused by the bending of the flexible part.
